KarlT Posted November 9, 2003 Posted November 9, 2003 Has anyone noticed that increasingly, the motherboard CPU sockets (at least for AMD processors) seem to be configured so that the CPU fan will blow sideways into the memory (thus blowing hot air on the memory stick nearest the CPU) because the socket tabs are on the top and bottom of the CPU socket instead of on the sides? And if one could find a heatsinck/fan that would have the clamp orientation rotated 90 degrees so that the fins would be vertical with these top/bottom tab sockets, many of the boards have capacitors (heat damageable, I would think) above the CPU socket, rather than having the socket at the top of the board. Is this business not a problem? Anyone know anything about this? Thanks. KarlT Quote
ross549 Posted November 10, 2003 Posted November 10, 2003 I personally don't see how that would be a problem..... I think that having moving air over the memory cards is a good idea. That way, if you are overclocking, you will not run into memory heat problems. Quote
ross549 Posted November 10, 2003 Posted November 10, 2003 True, but it is still moving....In my experience, moving hot air is better than no movement at all. Quote
Marsden11 Posted November 10, 2003 Posted November 10, 2003 Most cases have 2 fans in that general area. By blowing in cooler air, it negates any effects of "hot" air from the CPU/fan.When caps are in the way I just machine the heatsink to accomadate. Quote
nlinecomputers Posted November 10, 2003 Posted November 10, 2003 You are not the only one to complain about heat flow in the case. A new standard has been introduced called Balanced Technology Extended (BTX) that is supposed to handle air flow better so that cases can run cooler and quieter. http://www.formfactors.org/BTX Form Factor Specs in PDF format. Quote
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